求才內容說明

職務編號:

HW220540

職務類別:

系統/軟韌體

職務說明:

1. Accountable for engineering rigor and managing engineering resources to meet new product TTM goal. Facilitate technical discussion and help converge complex issue triage/closure.
2. Develop strategy and execution plan to support BU business growth plan in term of process, people, tool, external partnerships..etc.
3. Be sensitive in CSP datacenter’s technical roadmap and take preparation tasks accordingly.
4. Develop talents/organizational capability and maintain long-term FW team sustainability and technical leading position in server industry.
5. Current management bandwidth, HC about 50+ including BIOS, BMC, CPLD and FPGA team build up for tier-1 WW data center requirement.

工作地點:

桃園/新竹/苗栗

薪  資:

面議

專長條件:


企業背景

產業類別:

電子/電腦/週邊

公司背景:

電腦及其週邊設備製造業

我想了解

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