求才內容說明

職務編號：

 HJ250173

職務類別：

 機構

職務說明：

工作地點：

 桃園/新竹/苗栗

薪　　資：

 面議

專長條件：

 Education & Experience
• Bachelor’s or Master’s Mechanical Engineering or a related field.
• 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware.
• Experience in designing and architecting rack-level and system-level mechanical solutions.
• Hands-on experience in thermal, structural, and mechanical system design for high-performance computing.

Technical Skills
• CAD software proficiency (SolidWorks, Creo, CATIA, or similar).
• Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..).
• Expertise in sheet metal, plastics, and die-casting design and manufacturing processes.
• Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations.
• Experience with server chassis design, PCB and component integration, and EMI shielding.
• Understanding of rack-level power and cooling infrastructure.

Industry Knowledge & Standards
• Familiarity with server industry standards.
• Knowledge of data center environments and operational constraints.

Soft Skills & Leadership
• Strong problem-solving and analytical skills.
• Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers.
• Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles.
• Good communication skills for technical documentation and presentations.

企業背景

產業類別：

 電子/電腦/週邊

公司背景：

 電腦及其週邊設備製造業

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