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職務編號: |
HW250259 |
職務類別: |
硬體工程/研發技術 |
職務說明: |
1.PCB stack-up design & Constraint Rule setting. 2.Provide SI/PI design suggestions for PCB layout. 3.Signal integrity analysis of high-speed and low-speed signal interfaces. 4.Power integrity design includes DC impedance, AC resonance and capacitance optimization. 5.In addition to Cadence 2.5D EM solution as a daily necessary software, AMD SeaSim/S2Eye, Intel ICAT/IMLC/CCT are also required. 6.Use TCL and Python to shorten the complicated software operation process, generate reports and perform DOE analysis. 7.Familiar with PCB test coupon TDR/TDT measurement and Delta L 4.0 Measurement. |
工作地點: |
基隆/台北 |
薪 資: |
面議 |
專長條件: |
1.MS-Electrical Engineering or equivalent experience. 2.Strong understanding of electromagnetics including transmission line theory and PCB stack-up Design. 3.Hands on use of 2.5/3-D modeling tools like Cadence PowerSI, CST, ANSYS HFSS/Q3D/SIwave. 4.Hands on use of PCB layout tool Allegro and understand constraint management settings. 5.Familiarity with SI/PI analysis flow including frequency domain and time domain simulation. 6.Familiarity with high-speed I/O design concepts including clock generation, transmitter & receiver design, and equalization schemes. 7.Experience w/ Python, Matlab, VBS, or C for simulation automation. 8.5-8年NB廠/DT廠/ WS/AIO相關SI設計經驗 9.英文中等 |
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產業類別: |
電子/電腦/週邊 |
公司背景: |
電腦及其週邊設備製造業 |
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